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Degreasing and cleaning machine Product List

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e-Clean 2-liquid 1-tank degreasing cleaning device (HC solvent + HFE solvent)

A space-saving, low running cost, and low-priced ultrasonic cleaning device that achieves safe and easy cleaning and drying. Patent pending.

Cleaning with hydrocarbon (HC) based cleaning solvent ⇒ Rinsing with HFE solvent vapor ⇒ Recovery of fast-drying HFE solvent in the drying process (end of drying and cleaning) ⇒ Removal During cleaning, HC solvent is covered by HFE vapor and does not come into direct contact with air, eliminating the risk of ignition. The boiling point of the HFE solvent used in the rinsing process is 56°C, and the surface temperature of the items being cleaned does not rise above 56°C. Handling of the products after cleaning becomes very easy. All solvents used in this device can be recovered and reused (optional). Sales will begin for two models: Type 300 and Type 600. The dimensions of each cleaning fixture are 200mm × 300mm × 200mm H and 290mm × 350mm × 250mm H, respectively.

  • Ultrasonic Cleaner
  • Other semiconductor manufacturing equipment
  • Other environmental equipment

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Degreasing cleaning machine (co-solvent method)

Always regenerate and reuse cleaning solvents! A cleaning machine that achieves high cleaning precision and reduces solvent consumption.

The co-solvent method involves cleaning and drying using two types of cleaning solvents. It is a cleaning system that cleans with hydrocarbon-based cleaning solvents (HC solvents) and rinses and dries with HFE/HFC solvents (rinsing solvents). The dirt dissolved in the HC solvent is distilled and regenerated using an HC vacuum distillation machine and is discharged outside the equipment. The HC solvent brought into the rinsing solvent goes through a solvent separation device, and the HC solvent and rinsing solvent are returned to their respective cleaning tanks for reuse. By cleaning with HC solvents that have high surface tension and rinsing and drying with rinsing solvents that have low surface tension, high cleaning precision can be expected. Since the items being cleaned are not exposed to high temperatures, they are also easy to handle. [For more details, please download the catalog or feel free to contact us.]

  • Ultrasonic Cleaner
  • Other semiconductor manufacturing equipment
  • Other environmental equipment

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Finishing cleaning process: Degreasing cleaning device (co-solvent method)

In lens, prism, and precision parts cleaning, the cleaning solvent is always regenerated and reused, allowing for high cleaning precision. Moreover, the solvent consumption is significantly reduced.

Co-solvent method for cleaning and drying using two types of cleaning solvents. This cleaning system uses hydrocarbon-based cleaning solvents (HC solvents) for cleaning and HFE/HFC solvents (rinse solvents) for rinsing and drying. The dirt dissolved in the HC solvent is distilled and regenerated using an HC vacuum distillation machine and is discharged outside the equipment. The HC solvent brought into the rinse solvent undergoes a solvent separation process, and the HC solvent and rinse solvent are returned to their respective cleaning tanks for reuse. 【Features】 ○ Economical The cleaning solvent is reused due to the HC/HFE distillation unit and HC/HFE separation unit (significantly reduced solvent consumption). The expected solvent usage is calculated and presented during estimation. ○ Safe Solvents of safe Class 4 and Class 3 petroleum products with high flash points can be used. Non-cleaned items do not exceed the boiling point temperature of the fluorinated cleaning solvent. ○ Cleaning Precision After cleaning with hydrocarbon-based cleaning solvents with a surface tension of about 25 nN/m, rinsing and drying are performed with fluorinated cleaning solvents with a surface tension of about 13.6 nN/m. High-precision cleaning results can be expected. ● For other functions and details, please download the catalog.

  • Ultrasonic Cleaner
  • Other semiconductor manufacturing equipment
  • Other environmental equipment

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e-Clean 2-liquid 1-tank degreasing cleaning machine (HC solvent + HFE solvent)

Space-saving, low running cost, and low-priced ultrasonic cleaner! Achieves safe and easy drying.

Cleaning with hydrocarbon (HC) cleaning solvents ⇒ Rinsing with HFE solvent vapor ⇒ Collecting fast-drying HFE solvent in the drying process (end of drying and cleaning) ⇒ Removal. During cleaning, HC solvents are covered by HFE vapor and do not come into direct contact with air, eliminating the risk of ignition. The boiling point of the HFE solvent used in the rinsing process is 56°C, and the surface temperature of the items being cleaned does not rise above 56°C. Handling of the products after cleaning becomes very easy. All solvents used in this device can be recovered and reused (optional). Sales will begin for two models: the 300 type and the 600 type. The dimensions of each cleaning fixture are 200mm × 300mm × 200mmH and 290mm × 350mm × 250mmH, respectively.

  • Ultrasonic Cleaner
  • Other semiconductor manufacturing equipment
  • Other environmental equipment

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Degreasing Cleaning Machine (Co-solvent Method) [Significant reduction in solvent consumption!]

Significant reduction in solvent consumption! A cleaning machine that constantly regenerates and reuses cleaning solvents through distillation/separation.

The "Degreasing Cleaning Machine (Co-solvent Method)" by Okawa Kousan uses two types of cleaning solvents for cleaning and drying, allowing for powerful drying performance and enabling the selection of solvents with a focus on safety. Additionally, the cleaning solvent is returned to the cleaning tank and reused through a distillation device and a separation device. 【Features】 ◆ By regenerating and reusing the cleaning solvent, solvent consumption is drastically reduced ◆ Excellent drying performance allows for a focus on safety when selecting solvents ◆ Since the items being cleaned are not exposed to high temperatures, handling is easy 【For more details, please download the catalog or feel free to contact us】

  • Ultrasonic Cleaner
  • Other semiconductor manufacturing equipment
  • Other environmental equipment

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Degreasing cleaning machine (co-solvent method) [Significant reduction in solvent consumption!]

Reduce solvent consumption and drastically cut running costs! This cleaning machine continuously regenerates and reuses cleaning solvents through distillation and separation.

The "De-greasing Cleaning Machine (Co-solvent Method)" by Okawa Kousan uses two types of cleaning solvents for cleaning and drying, achieving powerful drying performance, allowing for solvent selection with a focus on safety. Additionally, the cleaning solvent is returned to the cleaning tank and reused through the distillation and separation devices. 【Features】 ◆ By regenerating and reusing the cleaning solvent, solvent consumption is greatly reduced ◆ Excellent drying performance allows for a focus on safety during solvent selection ◆ Since the items being cleaned are not exposed to high temperatures, handling is easy 【For more details, please download the catalog or feel free to contact us】

  • Ultrasonic Cleaner
  • Other semiconductor manufacturing equipment
  • Other environmental equipment

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